분야
pdfUtilization of E-beam
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E-beam evaporation
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E-beam sputter
Introduction
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Characteristics
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Principle
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Process
Methods
Summary
References
heated to generate electron.
Revolving 270, the electrons
are directed by
electromagnetic field
resulting collision onto the
source surface
After heated to certain
degree, source gas was
generated
The sensor monitors the
thickness of deposited film.
High vacuum should be kept in
the chamber not to contain
oxigen
gas which damages
substrate surface
After reaching sufficient
vacuum, argon gas is added
into the chamber to generate
argon cation.
The gas ion have a collision on
the targeting material affording
to a electron emmition.
The electrons are deposited on
the surface of substrate forming
metalic
coating
fab
Center
2) Jpn
J Appl
Phys 31,4232 (1992)
3)http://nanotech.nanopolis.net/samples/sample_ebl.ht
m
4) Jpn
J Appl
Phys 34,6658 (1995)
5) Jpn
J Appl
Phys 34,6663 (1995)
6) Handbook of semiconductor maufactureing
technology
7) http://web.cecs.pdx.edu