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[재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)

 1  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-1
 2  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-2
 3  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-3
 4  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-4
 5  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-5
 6  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-6
 7  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-7
 8  [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)-8
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    [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)에 대한 자료입니다.
    목차
    1.Subject

    2. Backgrond

    3. Component

    4. Condition

    5. Analysis

    6. Result and Discusstion

    7. Reference


    본문내용
    4. Condition

    If reflow, IMC layer occurs between the solder ball and substrate. IMC layer's composition changes depending on reflow time.

    Temperatuer
    255℃
    Reflow time
    1s, 1min, 5min, 10min, 20min
    Experimental conditions



    5. Analysis

    IMC layer change was observed according to the reflow time.(Reflow time : 1s, 1min, 5min, 10min, 20min). Do refer to .

    Reflow time
    IMC layer
    SEM micrographs
    1s
    (Ni,Cu)3Sn4

    The SEM micrographs of the Sn–3.5Ag–0.7Cu/Ni interface reflowed at 255℃

    참고문헌
    7. Reference

    IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. / Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung.

    #BGA#IMC#Ni#Pbfree